|
|
|
|
| LEADER |
01816nas a2200397 a 4500 |
| 001 |
101210567 |
| 003 |
DNLM |
| 005 |
20130509064509.0 |
| 007 |
cr unu-------- |
| 008 |
980825c19999999nyuqr p 0 a0eng |
| 010 |
|
|
|a sn 98001782
|
| 022 |
0 |
|
|a 1521-3331
|l 1521-3331
|2 1
|0 1
|
| 030 |
|
|
|a ITCPFB
|
| 035 |
|
|
|a (OCoLC)39742561
|
| 040 |
|
|
|a DNLM
|c DNLM
|
| 042 |
|
|
|a lc
|a nsdp
|
| 082 |
0 |
0 |
|a 621.317
|2 20
|
| 210 |
0 |
|
|a IEEE trans. compon. packag. technol.
|
| 222 |
|
0 |
|a IEEE transactions on components and packaging technologies
|
| 245 |
0 |
0 |
|a IEEE transactions on components and packaging technologies :
|b a publication of the IEEE Components, Packaging, and Manufacturing Technology Society.
|
| 246 |
3 |
0 |
|a Transactions on components and packaging technologies
|
| 246 |
3 |
0 |
|a Components and packaging technologies
|
| 246 |
3 |
|
|a Institute of Electrical and Electronics Engineers transactions on components and packaging technologies
|
| 260 |
|
|
|a New York, NY :
|b Institute of Electrical and Electronics Engineers,
|c c1999-
|
| 300 |
|
|
|a v. :
|b ill. ;
|c 28 cm.
|
| 310 |
|
|
|a Quarterly
|
| 362 |
0 |
|
|a Vol. 22, no. 1 (Mar. 1999)-
|
| 500 |
|
|
|a Title from cover.
|
| 510 |
0 |
|
|a Chemical abstracts
|x 0009-2258
|
| 530 |
|
|
|a Also available by subscription via the World Wide Web.
|
| 710 |
2 |
|
|a Institute of Electrical and Electronics Engineers.
|
| 710 |
2 |
|
|a Components, Packaging & Manufacturing Technology Society.
|
| 780 |
0 |
0 |
|t IEEE transactions on components, packaging and manufacturing technology. Part A
|x 1070-9886
|w (DLC) 94649784
|w (OCoLC)28525047
|
| 856 |
4 |
|
|u http://ieeexplore.ieee.org/servlet/opac?punumber=6144
|
| 999 |
|
|
|c 123524
|d 123524
|
| 952 |
|
|
|0 0
|1 0
|4 0
|7 0
|9 2182853
|a B-CSIC-IMB-CNM
|b B-CSIC-IMB-CNM
|h 1999-2010.
|o B-CSIC-IMB-CNM-2182853JNL-1521-3331
|p B-CSIC-IMB-CNM-2182853JNL-123524
|t 2890201
|y JNL
|
